JPH0727627Y2 - 半導体ウエハマウント装置 - Google Patents

半導体ウエハマウント装置

Info

Publication number
JPH0727627Y2
JPH0727627Y2 JP1988159008U JP15900888U JPH0727627Y2 JP H0727627 Y2 JPH0727627 Y2 JP H0727627Y2 JP 1988159008 U JP1988159008 U JP 1988159008U JP 15900888 U JP15900888 U JP 15900888U JP H0727627 Y2 JPH0727627 Y2 JP H0727627Y2
Authority
JP
Japan
Prior art keywords
wafer
semiconductor wafer
stage
tape
mounting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988159008U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0279037U (en]
Inventor
明男 小高
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP1988159008U priority Critical patent/JPH0727627Y2/ja
Publication of JPH0279037U publication Critical patent/JPH0279037U/ja
Application granted granted Critical
Publication of JPH0727627Y2 publication Critical patent/JPH0727627Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP1988159008U 1988-12-08 1988-12-08 半導体ウエハマウント装置 Expired - Lifetime JPH0727627Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988159008U JPH0727627Y2 (ja) 1988-12-08 1988-12-08 半導体ウエハマウント装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988159008U JPH0727627Y2 (ja) 1988-12-08 1988-12-08 半導体ウエハマウント装置

Publications (2)

Publication Number Publication Date
JPH0279037U JPH0279037U (en]) 1990-06-18
JPH0727627Y2 true JPH0727627Y2 (ja) 1995-06-21

Family

ID=31439841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988159008U Expired - Lifetime JPH0727627Y2 (ja) 1988-12-08 1988-12-08 半導体ウエハマウント装置

Country Status (1)

Country Link
JP (1) JPH0727627Y2 (en])

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63166243A (ja) * 1986-12-27 1988-07-09 Mitsubishi Electric Corp 半導体ウエハのテ−プ貼付装置

Also Published As

Publication number Publication date
JPH0279037U (en]) 1990-06-18

Similar Documents

Publication Publication Date Title
JPH09181153A (ja) 半導体ウェーハ固定装置
JPH06322533A (ja) コーティング装置又はエッチング装置の真空チャンバ内で扁平の円板状サブストレートを保持する装置
KR100417571B1 (ko) 판상재의 척 및 흡인반
JP3175232B2 (ja) 半導体ウェーハの接着方法
JPH04284648A (ja) ウエーハ支持用ドライチャックラバー
JPH0725463B2 (ja) 半導体装置の製造方法
JPH0727627Y2 (ja) 半導体ウエハマウント装置
JP3281390B2 (ja) 「光ディスク貼り合わせ装置及び貼り合わせ方法」
JPH09283392A (ja) 基板の重ね合わせ方法及び装置
JP2004322218A (ja) 真空吸着装置
JPH06244093A (ja) 基板保持方法ならびにそれを用いた薄膜多層基板の製造方法および装置
JPH10321654A (ja) チップのボンディング装置
JP3164629B2 (ja) 半導体ウエハ用真空チャックステージ
JPH10154671A (ja) 半導体製造装置、及び半導体装置の製造方法
JPH0794535A (ja) 半導体ペレット位置決め装置
JP2000233950A (ja) ガラスパネルのスペーサ配置方法およびガラスパネルの製造装置
JP2628501B2 (ja) ユニットタイルの製造方法
JPS60189746A (ja) 露光装置
JPH1012639A (ja) ボンディングコレット
JPH08186065A (ja) 陽極接合装置
JPH0310511Y2 (en])
JPS63245935A (ja) ペレツトボンデイング装置
JPS59134848A (ja) ウエハ−チヤツク
JP3118319B2 (ja) ウエーハ研磨用固定板
JP4665053B1 (ja) 薄板材料の吸着装置